Description
Description
Material: Silicone
Size: 100mm * 100mm * 1mm
- Heat-resistant temperature: -40 ? -220 ?
- High performance thermally conductive filling material
- Thermal conductivity: 2.4 watts / M-K
-Withstanding Voltage: 4KV / MM Tensile strength: 8KG / CM2
- Excellent adhesion + flexibility
- Excellent compression performance
- Great for CPU and GPU Components
- Great fore thermal Repad replacment
Material: Silicone
Size: 100mm * 100mm * 1mm
- Heat-resistant temperature: -40 ? -220 ?
- High performance thermally conductive filling material
- Thermal conductivity: 2.4 watts / M-K
-Withstanding Voltage: 4KV / MM Tensile strength: 8KG / CM2
- Excellent adhesion + flexibility
- Excellent compression performance
- Great for CPU and GPU Components
- Great fore thermal Repad replacment